Packaging for Low-Cost, High-Performance Microwave and Millimeter Wave Modules

ABSTRACT

Microwave or millimeter wave module packaging having a module with a baseplate, transition board and cover. The baseplate includes microwave or millimeter wave components attached thereto. The transition board includes a first connector attached to a first side thereof and operatively connected to the components, and a second connector attached to a second side thereof and operatively connected to the components through the board. The cover and baseplate form a cavity containing the board and components, and the second connector may be operatively connected to a third connector such as a printed circuit board disposed outside of the cavity and on a higher level assembly. The transition board may further include a fourth connector operatively connected to the components for providing a signal to an external component or device or receiving a signal from an external component or device.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.11/670,952, filed Feb. 2, 2007 and entitled “Packaging for Low-Cost,High-Performance Microwave and Millimeter Wave Modules,” which isincorporated herein by reference.

BACKGROUND

Recent advances in microelectronic technologies have resulted inimprovements in operating frequency capabilities of specializedelectronic devices such as monolithic microwave integrated circuits(MMICs) and other millimeter wave and microwave devices. These devicesare well suited for and often utilized in military and commercialapplications requiring wireless communication, detection, ranging andguidance at high frequencies.

The performance capabilities of the devices may be compromised bymounting the device into a package or assembly that adds parasitics anddegrades the signal characteristics at higher operating frequencies.These assemblies typically allow an electronic device to be mountedwithin a suitable enclosure while enabling RF input and output (I/O)signals, as well as a DC bias signal, to be communicated through theassembly walls to the device itself, or conversely, from the device toexternal complimentary circuits. These devices are typically in the formof modules as an increasing use is made of millimeter wave and microwavetransceivers and other such devices. Often, these modules are utilizedwith various transceiver designs having different transmitter andreceiver circuits that make use of a number of different MMIC chips ordies.

Prior art RF assemblies of this type, and more specifically the assemblytransitions, are often found to have high RF losses, voltagereflections, electrical mismatching and discontinuity inadequacies thatexceed acceptable limits and may limit frequency performancecapabilities. This often fails to maximize the performance potential ofan electronic device or communication system or may degrade device andsystem performance. Alternatively, expensive cables and/or connectorsare designed into the assemblies to preserve the device performance andto preserve the signal characteristics as they travel through theassemblies.

For example, three areas of packaging representative of devices ormodules in the microwave and millimeter wave industry are connectorizedamplifiers, internally matched field effect transistors (FET), andsurface-mount packaged MMICs. Connectorized amplifiers may generally becharacterized by their ruggedness. The respective housings generallyinclude coaxial RF connectors (e.g., two if a 2-port device or more ifthe device is an n-port). These connectors are typically “fieldreplaceable” surface mount assemblies that possess an RF feed-throughsoldered or brazed into the housing (e.g., bathtub style or separateringframe). Additionally, in typical prior art assemblies, DC is broughtinto the respective housing through capacitively coupled feed-throughsthat may be soldered or brazed into the housing. Generally, the RF pathis connected to other modules through coaxial cable assemblies, and theDC connections are soldered, or connected to other modules through DCcable assemblies. Such an assembly or package is hermetic and in thissense, it may be labeled as “military microwave hardware” with theexpense implied therefrom.

Internally Matched FETs generally represent a focus on the commercialsector and, as such, these devices are not expected to endure theconditions required by military applications. These respectiveassemblies are typically constrained to 1-stage, 2-port devices and areused for high-power devices where the corresponding baseplate materialis employed for heat transfer purposes. The FET may be attached to thebaseplate to minimize the thermal resistance of the heat path.Generally, a hard ceramic material is employed on the I/Os to provide apower match to the respective device. Bondwires are used to attach thedevice to the ceramic material, and a tab is generally attached to theceramic material and extended from the assembly to provide both an RFconnection and DC connection. The DC connections are typically gate(−V), drain (+V) and source (ground) connections. Thus, the intended useof such a device is to have a respective assembly contain a printedcircuit board (PCB) to accept the internally matched FET. The assemblyis then mechanically attached for thermal and electrical grounding, andthe RF I/O tabs are soldered to the PCB.

Surface-mount packaged devices generally possess two or more RF portsdepending upon the functionality thereof (e.g., amplifiers, mixers,MMICs, FETs, etc.). A typical attachment method is soldering all pinsrather than a mechanical attachment means. For devices dissipatingsignificant power, the accepting PCB generally includes plural vias toremove the associated heat. In this example, the package may possess aback-side metal paddle in addition to the pins. Such packages aregenerally limited in frequency to prevent parasitics from impacting theperformance of the internal device. Therefore, improvements to thesepackages are desired to reduce their associated parasitics and extendtheir range of unimpaired useful frequencies. Generally, the number ofdevices in such a package is limited since suppliers desire to targetthe maximum number of users. An exemplary industry focusing uponmultiple chip solutions inside the package is the cell phone and 802.11card business.

Thus, a continuing need exists for an improved assembly, particularlyfor microwave and millimeter wave systems operating in higher frequencyranges. As greater uses are made for microwave and millimeter wavemodules, it would be advantageous if a unique structure and method couldbe found that addressed the low cost and performance requirements in thearea of millimeter wave and microwave modules without degradation to thetechnical performance of a respective transceiver, transmitter, orreceiver and/or communication system.

SUMMARY

Embodiments of the present subject matter address the problemsencountered in the prior art by providing a solution at a subsystemlevel. For example, a respective package may possess an enclosure tophysically protect the contents, enable easy assembly of themicrowave/millimeter wave components, utilize inexpensive RF/DCconnectors, and provide for connections to a higher level assembly thatprovides a protected electromagnetic interference environment.

The aforementioned prior art systems and methods fail to address theperformance requirements in microwave and millimeter wave radio systems.Accordingly, there is a need for a novel method and system that wouldovercome the deficiencies of the prior art. Thus, an embodiment of thepresent subject matter provides a module comprising a baseplate having amicrowave or millimeter wave component attached thereto and asubstantially planar transition board having a first connector attachedto a first side of the board and operatively connected to the component,and a second connector attached to a second side of the board andoperatively connected to the component through the board. The modulefurther comprises a cover where the cover and baseplate form a cavitycontaining the board and component and where the second connector isoperatively connected to a third connector disposed outside of thecavity. An alternative embodiment may further include a fourth connectoron the transition board operatively connected to the component forproviding a signal to an external component or device or receiving asignal from an external component or device.

Another embodiment of the present subject matter provides an assemblycomprising a structure having an indentation for accepting a module. Theindentation may be bounded on one side of a printed circuit board wherethe module comprises a baseplate having a microwave or millimeter wavecomponent attached thereto, a substantially planar transition boardhaving a first connector attached to a first side of the board andoperatively connected to the component, and a second connector attachedto a second side of the board and operatively connected to the componentthrough the board, and a first cover where the first cover and baseplateform a cavity containing the board and component. An alternativeembodiment may further include another connector on the transition boardoperatively connected to the component for providing a signal to anexternal component or device or receiving a signal from an externalcomponent or device. The assembly may further comprise a second coverwhere the module is disposed within the indentation such that the secondconnector is operatively connected to the printed circuit board, andwhere the second cover and structure enclose the module.

An additional embodiment of the present subject matter provides acommunication system operating in a predetermined frequency range. Thesystem may comprise a plurality of assemblies, at least one assemblycomprising a structure having an indentation for accepting a module, theindentation bounded on one side by a printed circuit board. The modulecomprises a baseplate having a microwave or millimeter wave componentattached thereto, a substantially planar transition board having a firstconnector attached to a first side of the board and operativelyconnected to the component, and a second connector attached to a secondside of the board and operatively connected to the component through theboard, and a first cover where the first cover and baseplate form acavity containing the board and component. An alternative embodiment mayfurther include another connector on the transition board operativelyconnected to the components for providing a signal to an externalcomponent or device or receiving a signal from an external component ordevice. The assembly may further comprise a second cover, where themodule is disposed within the indentation such that the second connectoris operatively connected to the printed circuit board, and where thesecond cover and structure enclose the module.

A further embodiment of the present subject matter provides a method foreliminating feed-throughs in an assembly. The method comprises the stepsof providing a structure having an indentation for accepting a module,the indentation bounded on one side by a printed circuit board andoperatively connecting a module to the printed circuit board. The modulemay generally comprise a baseplate having a microwave or millimeter wavecomponent attached thereto, a substantially planar transition boardhaving a first connector attached to a first side of the board andoperatively connected to the component, and a second connector attachedto a second side of the board and operatively connected to the componentthrough the board. An alternative embodiment may further include anotherconnector on the transition board operatively connected to thecomponents for providing a signal to an external component or device orreceiving a signal from an external component or device. The module mayfurther comprise a first cover where the first cover and baseplate forma cavity containing the board and component. The method furthercomprises the step of removably attaching a second cover to thestructure to enclose the module.

These embodiments and many other features and advantages thereof will bereadily apparent to one skilled in the art to which the inventionpertains from a perusal of the claims, the appended drawings, and thefollowing detailed description of the embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a module according to an embodiment ofthe present subject matter.

FIGS. 2A and 2B are perspective views of an assembly according to anembodiment of the present subject matter.

FIG. 3 is a flowchart illustrating a method for eliminatingfeed-throughs in an assembly according to an embodiment of the presentsubject matter.

FIG. 4A is a plan view of an assembly according to another embodiment ofthe present subject matter.

FIG. 4B is a cross section of the assembly of FIG. 4A along line A-A.

FIG. 5A is a perspective view of a module according to anotherembodiment of the present subject matter.

FIG. 5B is an exploded view of the module of FIG. 5A.

FIG. 6 is a perspective view of the assembly of FIGS. 4A and 4B.

FIG. 7A is a plan view of an assembly according to an alternativeembodiment of the present subject matter.

FIG. 7B is a cross section of the assembly of FIG. 7A along line A-A.

FIG. 8 is a perspective view of the assembly of FIGS. 7A and 7B.

DETAILED DESCRIPTION

With reference to the figures where like elements have been given likenumerical designations to facilitate an understanding of the presentsubject matter, the various embodiments of a system, method andapparatus for packaging for low-cost, high-performance microwave andmillimeter wave modules are herein described.

FIG. 1 is a perspective view of a module according to an embodiment ofthe present subject matter. With reference to FIG. 1, a module 100 isillustrated having a baseplate 10 adaptable to possess microwave ormillimeter wave components (not shown) assembled thereon. Exemplarycomponents may be DC and/or RF components. For example, the componentsmay he monolithic microwave integrated circuit chips (MMIC), fieldeffect transistors, transistors, diodes, mixers, multipliers,modulators, amplifiers, attenuators, switches, circulators, isolators,filters, couplers, detectors, splitters, combiners, alumina (or otherceramic) substrates for matching transistors or MMICs, alumina (or otherceramic) substrates for realizing microwave/millimeter wave functions,or any combinations thereof. Additional, components that may beassembled on the baseplate also include duroid (softboard) to realizemicrowave/millimeter wave functions, and/or hardboard for biascircuitry, signal conditioning, etc. The embodiment of the presentsubject matter illustrated in FIG. 1 is adaptable to all microwavefrequency applications such as, but not limited to, a transmitter, areceiver, a transceiver, etc., and the components thereof may bemodified to different ranges of desired frequencies. For example, anyone or a number of the aforementioned components may operate in the 6GHz point to point radio band. Thus, if the module employs a 3-port withmixing function, the RF range may he significantly wider than 2 GHz;however, the aforementioned frequency ranges are not intended to limitthe scope of the claims appended herewith and embodiments of the presentsubject matter may be utilized with a wide range of frequencies.

The baseplate 10 of the module 100 may be substantially flat to enable“pick and place” installation of microwave/millimeter wave componentsthereto. In an alternative embodiment of the present subject matter, thebaseplate 10 may include a raised area coated with epoxy for theattachment of the microwave/millimeter wave components. The componentsmay thus be assembled directly onto the baseplate 10 that may be coatedwith conductive epoxy without any carriers. Further, an auto-bonder maybe utilized to provide RF and/or DC connections between any componentson the baseplate 10.

A substantially planar transition board 20 may be operatively and/orremovably connected to the components on the baseplate 10 by screws,bolts, pins 12 or another attachment means such as epoxy. An exemplarytransition board 20 may include, but is not bruited to, hardboard, suchas FR-4. The transition board 20 may possess a first set of connectorsoperatively connected to the components and a second set of connectors23 attached to a second side 24 of the transition board 20. An exemplaryfirst set of connectors may be bondwire or other known connectors in theart. The connections to the components on the baseplate 10 provided bythe first connectors may be direct connections without a wire or cable,e.g., an autobond to the components for DC and RF connections. Thesecond connectors 23 are operatively connected to the components throughthe transition board 20 and may be attached thereto by epoxy, screws,pins or other known attachment means. An alternative embodiment of thepresent subject matter may employ a transition board 20 having a firstportion and a second portion rather man a single substantially planarboard. For example, the first portion may possess the first Set ofconnectors facing the baseplate 10 operatively connected to thecomponents. The second portion may possess the second set of connectors23 operatively connected to the components through the board. Further,in this alternative embodiment, the two portions may be constructed ofdifferent materials.

The module 100 further includes a cover 30 that forms a cavitycontaining the transition board 20 and any components on the baseplate10. The cover 30 may thus be utilized to protect any bondwires andprovide a fixed cavity environment for the microwave/millimeter wavecomponents. The cover 30 may be constructed of metal or may bemetallized to provide the fixed electrical environment. The cover 30,however, does not provide a controlled EMI environment for the module;rather, a higher level assembly may provide this function. The cover 30may be mechanically and removably attached to the baseplate 10 byscrews, bolts, pins or other attachment means 32 to enable reworkingand/or testing of microwave/millimeter wave components.

The second connectors 23 may be operatively connected to a thirdconnector (not shown) disposed outside of the cavity formed by thebaseplate 10 and cover 30. For example, an embodiment of the presentsubject matter may utilize blind mate connectors as the secondconnectors 23 to mate with a printed circuit board (PCB) positioned on ahigher level assembly disposed outside of the cavity. Thus, the modulemay provide power and signal connections to the transition board 20rather than to either the baseplate 10 or the cover 30 to eliminate theneed for expensive cabling to make the DC and RF connections. Therefore,connections provided on and through the transition board 20 replace theexpensive, feed-throughs (e.g., DC, capacitive, and RF) traditionallyused in the prior art and enable quick, unimpaired DC and RF connectionto a higher level assembly. Exemplary DC connectors may be inexpensiveDC connectors, e.g., one penny per pin, that arrive soldered to thetransition board 20. Alternative embodiments of the present subjectmatter may also employ DC connectors with surface mount PCB capacitorssoldered to the transition board 20 to preclude problems with conductedemissions and interference.

Further embodiments of the present subject matter may employ a fourthset of connectors 22. The fourth connectors 22 may be operativelyconnected to the components directly or through the transition board 20and may be attached thereto by epoxy, screws, pins or other knownattachment means. For example, a module 100 according to an embodimentof the present subject matter may be employed in a transmitter. Thefourth connector 22 may then provide an output signal to an externalcomponent or device, and the second connectors 23 may receive an inputsignal. A module 100 may also be employed in a receiver. In such anembodiment, the fourth connector 22 may receive an input signal from anexternal component or device, and the second connectors 23 may providean output signal. Exemplary fourth connectors may be a waveguide launch,RF connectors, or other devices and/or connectors for inputting oroutputting a signal. Embodiments of the present subject matter employingthe fourth connector(s) 22 may further include a corresponding aperture33 in the cover 30 to provide access to and from the fourth connector(s)22. Modules according to embodiments of the present subject matter areadaptable to all microwave frequency applications such as, but notlimited to, a transmitter, a receiver, a transceiver, etc., andcommunication systems employing such applications, and theaforementioned examples are not intended to limit the scope of theclaims appended herewith.

FIGS. 2A and 2B are perspective views of an assembly according to anembodiment of the present subject matter. With reference to FIGS. 2A and2B, an assembly 200 is provided having structure 205 with an indentation210 for accepting a module 100 according to an embodiment of the presentsubject matter. The indentation 210 may be bounded on one side thereofby a printed circuit board (PCB) 212, two sides by a second cover 220,and the remaining three sides by aluminum housing 211. The PCB 212 maybe operatively connected to the module 100 via a third set of connectors214 adaptable to mate with the second connectors 23. For example, anembodiment of the present subject matter may utilize blind mateconnectors 214 on the PCB 212 to mate with the second connectors 23 on amodule 100. Thus, the assembly 200 may provide power and signalconnections to the module 100 and eliminate any expensive cabling tomake the DC and RF connections and enable quick, unimpaired DC and RFconnection to the module 100.

The second cover 220 is adaptable to mechanically and removably attachto the structure of the assembly 200 and enclose a module 100operatively connected to the PCB 212. The cover 220 may be attached tothe structure 205 by screws, bolts, pins or other attachment means 222to allow simple access to and installation of the module 100. Theindentation 210 together with the second cover 222 defines a cavity thatprovides electromagnetic interference protection for an enclosed module100. Furthermore, portions 207 of the structure 205 may provide tins oranother known heat transfer structure to convey heat away from themodule 100. The embodiment of the present subject matter illustrated inFIGS. 2A and 2B is adaptable to all microwave frequency applicationssuch as, but not limited to, a transmitter, a receiver, a transceiver,etc., and communication systems employing such, applications. Further,communication systems having assemblies according to embodiments of thepresent subject matter may employ plural assemblies depending upon therequirements of the respective system.

FIG. 3 is a flowchart illustrating a method for eliminating feedthroughs in an assembly according to an embodiment of the presentsubject matter. With reference to FIG. 3, in step 302, a structure isprovided having an indentation for accepting a module. The indentationmay be bounded on one side thereof by a PCB. In step 304, a module maybe operatively connected to the PCB. The module may comprise a baseplatehaving microwave or millimeter wave components attached thereto, atransition board having a first connector attached to a first sidethereof and operatively connected to the components, and a secondconnector attached to a second side thereof and operatively connected tothe components through the transition board. The module may furthercomprise a first cover where the cover and baseplate form a cavitycontaining the board and the microwave/millimeter wave componentsattached to the baseplate. In step 306, a second cover may be removablyattached to the structure to enclose the module. Through the attachmentof the second cover to the structure, thereby enclosing a moduleoperatively connected to the PCB, the second cover acts to provideelectromagnetic interference protection for the module. Alternativeembodiments of the present subject matter may employ a gasket inportions of the indentation, second cover, and/or interface therebetweento provide electromagnetic interference protection for the module. Thestructure also provides a heat sink for heat generated by the module andcomponents therein.

FIG. 4A is a plan view of an assembly according to another embodiment ofthe present subject matter. FIG. 4B is a cross section of the assemblyof FIG. 4A along line A-A. FIG. 5A is a perspective view of a moduleaccording to another embodiment of the present subject matter, and FIG.5B is an exploded view of the module of FIG. 5A. With reference to FIGS.4A, 4B, 5A, and 5B, a module 400 may include amplifying and/or biascircuitry and components 402 assembled on a baseplate 410 and atransition board 420 operatively and/or removably connected to thecircuitry 402. Connectors 412 are provided on the transition board 420adaptable to mate with a transmitter PCB 450 positioned in an assembly500. Additional connectors 414 such as RF connectors may be provided onthe module 400 to supply appropriate RF connections with the transmitterPCB 450. In alternative embodiments of the present subject matter, anyone or all of the connectors 412, 414 may be re-oriented ninety degreesto facilitate in a blind mate connection with the transmitter PCB 450.The module 400 may further include a cover 430 or body forming a cavitywith the baseplate 410 to contain the transition board 420 andamplifying and/or bias circuitry and components 402. Portions of thecover 430 may include fins 432 or other structures to transfer heat fromthe module 400. Further, a fan 434 may be operatively connected to thetransmitter PCB 450 via a fan connection 452 to provide additionaltransfer of heat from the module 400. An isolator 404 may also beprovided operatively connected to the module 400. An additional heatsink 460 may be removably attached to the module 400 to assist in heattransfer therefrom, and the transmitter PCB 450 may also be equippedwith a heat sink 462 to remove heat. Backplane connectors 502 may beprovided on the assembly 500 to allow connections to other communicationsystem components and circuitry.

FIG. 6 is a perspective view of the assembly of FIGS. 4A and 4B. Withreference to FIG. 6, a module according to an embodiment of the presentsubject matter is shown mated with an assembly 500. The assembly 500comprises a structure having an indentation 506 for accepting the module400 such that the module 400 is operatively connected to the transmitterPCB 450. The assembly 500 further includes a second cover 540 to enclosethe module 400. A fan 434 may be removably attached to the assembly 500and operatively attached to the transmitter PCB 450 to provideadditional transfer of heat from the module 400. The assembly 500 mayalso employ a frontal heat sink 542.

FIG. 7A is a plan view of an assembly according to an additionalembodiment of the present subject matter. FIG. 7B is a cross section ofthe assembly of FIG. 7A along line A-A. With reference to FIGS. 7A and7B, a module 700 may include amplifying and/or bias circuitry andcomponents 702 assembled on a baseplate 710 and a transition board 720operatively and/or removably connected to the circuitry 702. Connectors712 are provided on the transition board 720 adaptable to mate with atransmitter PCB 750 positioned in an assembly 800. Additional connectors714 such as RF connectors may be provided on the module 700 to supplyappropriate RF connections with the transmitter PCB 750. The module 700may further include a cover 730 or body forming a cavity with thebaseplate 710 to contain the transition board 720 and amplifying and/orbias circuitry and components 702. A fan 734 may be operativelyconnected to the transmitter PCB 750 via a fan connection 752 to provideadditional transfer of heat front the module 700. An isolator 704 mayalso be provided operatively connected to the module 700. Thetransmitter PCB 750 may be equipped with a heat sink 762 to remove heat.Backplane connectors 802 may be provided on the assembly 800 to allowconnections to other communication system components and circuitry.

FIG. 8 is a perspective view of the assembly of FIGS. 7A and 7B. Withreference to FIG. 8, a module according to an embodiment of the presentsubject matter is shown mated with an assembly 800. The assembly 800comprises a structure having an indentation for accepting the module 700such that the module 700 is operatively connected to the transmitter PCB750. The assembly 800 further includes a second cover 840 to enclose themodule 700. A fan 734 may be removably attached to the assembly 800 andoperatively attached to the transmitter PCB 750 to provide additionaltransfer of heat from the module 700. The assembly 800 may also employ afrontal heat sink 842.

It is thus an aspect of embodiments of the present subject matter toexclude assemblies having a ringframe, baseplates having a bathtub-stylehousing, and/or carriers in the respective RF modules. It is a furtheraspect of the present subject matter to reduce the package costs of thinfilm assemblies.

Embodiments of the present subject matter provide for uncompromisedperformance to be achieved with MMICs and ceramic components because ofthe flexibility of the packaging and assembly approach. Embodiments ofthe present subject matter allow for automated pick and place andautomated wirebonding. Transition boards according to embodiments of thepresent subject matter provide for low cost connections to the higherlevel assembly which provides a protected EMI environment for therespective module.

One embodiment of the present subject matter provides a modulecomprising a baseplate having a microwave or millimeter wave componentattached thereto and a substantially planar transition board having afirst connector attached to a first side thereof, the first connectoroperatively connected to the component. The transition board alsoincludes a second connector attached to a second side thereof, thesecond connector operatively connected to the component through theboard. The module further comprises a cover where the cover andbaseplate form a cavity containing the board and component, and wherethe second connector is operatively connected to a third connectordisposed outside of the cavity. An alternative embodiment may furtherinclude a fourth connector on the transition board operatively connectedto the components for providing a signal to an external component ordevice or receiving a signal from an external component or device.

Another embodiment of the present subject matter provides an assemblycomprising a structure having an indentation for accepting a module, theindentation bounded on one side by a printed circuit board. The modulemay comprise module a baseplate having a microwave or millimeter wavecomponent attached thereto and a substantially planar transition boardhaving a first connector attached to a first side thereof, the firstconnector operatively connected to the component. The transition boardalso includes a second connector attached to a second side thereof, thesecond connector operatively connected to the component through theboard. The module further comprises a cover where the cover andbaseplate form a cavity containing the board and component. The modulemay be disposed within the indentation such that the second connector isoperatively connected to the printed circuit board. An alternativeembodiment may further include another connector on the transition boardoperatively connected to the components for providing a signal to anexternal component or device or receiving a signal from an externalcomponent or device. The assembly further comprises a second cover toenclose the module to provide electromagnetic interference protection.

An additional embodiment of the present subject matter provides acommunication system operating in a predetermined frequency rangecomprising a plurality of assemblies, at least one assembly comprising astructure having an indentation for accepting a module, the indentationbounded on one side by a printed circuit board. The module may comprisemodule a baseplate having a microwave or millimeter wave componentattached thereto and a substantially planar transition board having afirst connector attached to a first side thereof the first connectoroperatively connected to the component. The transition board alsoincludes a second connector attached to a second side thereof, thesecond connector operatively connected to the component through theboard. The module further comprises a cover where the cover andbaseplate form a cavity containing the board and component. The modulemay be disposed within the indentation such that the second connector isoperatively connected to the printed circuit board. An alternativeembodiment may further include another connector on the transition boardoperatively connected to the components for providing a signal to anexternal component or device or receiving a signal from an externalcomponent or device. The assembly further comprises a second cover toenclose the module to provide electromagnetic interference protection.

A further embodiment of the present subject matter provides a method foreliminating feed-throughs in an assembly. The method comprises the stepsof providing a structure having an indentation for accepting a module,the indentation bounded on one side by a printed circuit board andoperative connecting a module to the printed circuit board. The modulecomprises a baseplate having a microwave or millimeter wave componentattached thereto and a substantially planar transition board having afirst connector attached to a first side thereof, the first connectoroperatively connected to the component. The transition board alsoincludes a second connector attached to a second side thereof, thesecond connector operatively connected to the component through theboard. The module further comprises a cover where the cover andbaseplate form a cavity containing the board and component. The methodfurther comprises the step of removably attaching a second cover to thestructure to enclose the module. An alternative embodiment may furthercomprise providing electromagnetic interference protection to themodule. An additional embodiment may also comprise transferring heatgenerated from the component to the structure.

As shown by the various configurations and embodiments illustrated inFIGS. 1-8, a system, method and apparatus for packaging for low-cost,high-performance microwave and millimeter wave modules have beendescribed.

While preferred embodiments of the present subject matter have beendescribed, it is to be understood that the embodiments described areillustrative only and that the scope of the invention is to be definedsolely by the appended claims when accorded a full range of equivalence,many variations and modifications naturally occurring to those of skillin the art from a perusal hereof.

1. A method for eliminating feed-throughs in an assembly comprising thesteps of: providing a structure having an indentation for accepting amodule, said indentation bounded on one side by a printed circuit board;operatively connecting a module to the printed circuit board, the modulecomprising: a baseplate having a microwave or millimeter wave componentattached thereto; a substantially planar transition board having a firstconnector attached to a first side of said board and operativelyconnected to said component, and a second connector attached to a secondside of said board and operatively connected to said component throughsaid board, said connectors providing a direct connection without a wireor cable; and a first cover wherein said first cover and said baseplateform a cavity containing said board and said component; and removablyattaching a second cover to the structure to enclose the module, whereinpower and signal connectors to the module are not attached to either thebaseplate or the cover.
 2. The method of claim 1, wherein the componentis selected from the group consisting of: monolithic microwaveintegrated circuit chips, field effect transistors, transistors, diodes,mixers, multipliers, modulators, amplifiers, attenuators, switches,circulators, isolators, filters, couplers, detectors, splitters,combiners, substrates, or combinations thereof.
 3. The method of claim1, wherein connection between said second connector and said printedcircuit board is a blind mate connection.
 4. The method of claim 1,wherein the step of removably attaching a second cover further comprisesproviding electromagnetic Interference protection.
 5. The method ofclaim 1, wherein the step of operatively connecting a module to theprinted circuit board further comprises transferring heat generated fromthe component to the structure.